SOM-5992 COM Express 3.0 Type 7

  • SOM-5992 is Not Recommended for New Designs "NRND"
  • Last Time buy date 11/30/2022
  • Intel® Xeon® Processor D-1500 Product Family
  • COM Express R3.0 Basic Module Type 7 pinout
  • 2~16 core processor, with max. TDP 45W
  • Dual-CH DDR4 2400 w/ECC, max. 128GB
  • High-speed Ethernet (dual 10GBASE-KR interfaces, one GbE)
  • Abundant expansion. (PCIe x16, PCIe x8, 8 PCIe x1)

SOM-5992, designed around the Intel® Xeon® Processor D-1500 family, brings the performance and advanced intelligence of Intel® Xeon® processors into a dense, low-power system-on-a-chip. With enhanced reliability, availability, and serviceability features, platform storage extensions, and built-in hardware virtualization, the Intel® Xeon® processor D-1500 product family offers new possibilities for a variety of applications.

Features

  • Intel® Xeon® Processor D-1500 Product Family
  • COM Express R3.0 Basic Module Type 7 pinout
  • 2~16 core processor, with max. TDP 45W
  • Dual-CH DDR4 2400 w/ECC, max. 128GB
  • High-speed Ethernet (dual 10GBASE-KR interfaces, one GbE)
  • Abundant expansion. (PCIe x16, PCIe x8, 8 PCIe x1)

Overview

SOM-5992, designed around the Intel® Xeon® Processor D-1500 family, brings the performance and advanced intelligence of Intel® Xeon® processors into a dense, low-power system-on-a-chip. With enhanced reliability, availability, and serviceability features, platform storage extensions, and built-in hardware virtualization, the Intel® Xeon® processor D-1500 product family offers new possibilities for a variety of applications. SOM-5992 is suitable for midrange routers, network appliances, security appliances, wireless base stations, embedded midrange IoT devices, entry networking, midrange storage area networks (SANs), network-attached storage (NAS) appliances, warm cloud storage, and more.

In a breakthrough move, SOM-5992 supports a maximum of 128 GB DDR4 memory which should help fulfill the ever-increasing server application demands in the area of COM Express. The Intel® Xeon® processor D-1500 delivers 16 processor cores and 64 GB memory, combined with computer-on-module flexibility, this is an optimal solution for users who want extreme computing performance and non-stop service. Moreover, the SOM-5992 incorporates two 10GBase-KR interfaces for integrating with 10GbE customer carrier boards. PCIe x16 and 8 PCIe x1 Supports Non-Transparent Bridge (NTB), which allows redundancy via PCIe. This helps reduce data loss, allowing a secondary system to take over PCIe storage device management if a CPU fails, and provides high availability for applications requiring continuous service.

SOM-5992 has four screw holes near the CPU, positioned in compliance with the Intel® standard thermal design guide. The thermal module is attached to the CPU in a balanced torque design, and it is the first COM Express to have an added backplane to increase rigidity like a single board, so the thermal module makes tight contact with the CPU with no board bending. This result is highly efficient heat dissipation with outstanding computing performance. The SOM-5992-thermal solution pre-assembly service that can assist in system-level assembly.

Specifications

Processor
CPU
Intel® Xeon® Processor D-1500
Clock Speed
2.7 GHz
Processor Misc.
CPU Base Speed Turbo Speed Cores CPU wattage
Xeon D-1577 1.3 GHz 2.1 GHz 16 45W
Xeon D-1548 2.0 GHz 2.6 GHz 8 45W
Xeon D-1537 1.7 GHz 2.3 GHz 8 35W
Xeon D-1528 1.9 GHz 2.5 GHz 6 35W
Xeon D-1527 2.2 GHz 2.7 GHz 4 35W
Pentium D1517 1.6 GHz 2.2 GHz 4 25W
Pentium D1508 2.2 GHz 2.6 GHz 2 25W
Xeon D-1559 1.5 GHz 2.1 GHz 12 45W
Xeon D-1539 1.6 GHz 2.2 GHz 8 35W
Pentium D1519 1.5 GHz 2.1 GHz 4 25W
Memory
RAM
up to 128GB DDR4 (4x SODIMM)
Memory Misc.

ECC Support:  ECC and non-ECC
Max. Capacity:  up to 128GB
Socket:  Dual Channel, 4x 260P SODIMM
Primary IO
GPIO
8x GPIO
Disk Interface
2x SATA
Ethernet
2x 10G INTEL LAN controller & Intel I210AT/I210IT 10/100/1000 Mbps
USB
4x USB 3.0 & 4x USB 2.0
Serial Ports
2x COM (2-Wire)
Secondary IO
SPI
Yes for BIOS ROM
Expansion
Bus Expansion
COM Express R3.0 Type 7 compatible
Bus Misc.

PCI Express x16 1 PCIe x16 Gen.3, and bifurcatable to 2 x8, 1 x8 & 2 x4, or 4 x4
PCI Express x8 1 PCIe x8 Gen.3, and bifurcatable to 2 x4
PCI Express x1 7 Ports, PCIe x1 Gen.2, and bifurcatable to x2 or x4 (max. 8 Ports if remove GbE LAN)
LPC Yes. 33MHz, support DMA read/write
Misc
Operating Systems
EMAC OE Linux, Windows Embedded Standard 2009 / WES09 (Windows XPE )
SOM Type
COM Express Modules

Mechanical and Environmental

Dimensions
Size
4.92" ×3.74" (124mm × 94mm)
Power Requirements
Power Misc.

Type ATX: Vin, VSB, AT: Vin
Supply Voltage Vin: 8.5 (9-5%) ~ 20V (19+5%), VSB: 5V±5%, RTC Battery: 2.0-3.3V
Power Consumption (Max.) Burn-in: 50.26W ; Turbo on: 55.53W
Power Consumption (Idle) 12.34W
Environmental
Low Operating Temperature0 C (32 F)
High Operating Temperature60 C (140 F)
Upper Operating Humidity
95%
Environmental Misc.
Operating Standard: 0 ~ 60° C (32 ~ 140° F) Extend Temp. : -40 ~ 85° C (-40 ~ 185° F) with 0.7m/s air flow Storage: -40 ~ 85° C (-40 ~ 185° F)

Pricing

Pricing correct as of January 2021. Please contact EMAC for Current Pricing and Lead Time. Due to volatility in the electronics industry pricing is subject to change.

OEM / Quantity Pricing Available on Request - Less Services

(Single Unit Pricing. Includes: Integration, Setup,Testing, & Enhanced Support)

Product # Description Price

Carrier Board Options

Product #VariationPrice
$0.00

Additional Options